Combined analysis of a processor in cooperation with TESCAN company
A joint project called ‘In-depth Analysis of 10 nm Exynos Processor using Micro CT and FIB-SEM System’ with TESCAN company was presented at the IPFA conference (26th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits) at 2nd - 5th July 2019. The project aims at the imaging of the Exynos processor first by nondestructive micro CT imaging to get the overall view of the inner structure of the sample. Micro CT was then complemented with FIB-SEM (focused ion beam-scanning electron microscopy) on a selected region of the sample. This approach allows reverse engineering of electronic parts and enables reliable fault isolation and analysis.